Seoul: Samsung Electronics Co. and SK hynix Inc. unveiled their latest high bandwidth memory (HBM) chips at a semiconductor exhibition in Seoul, marking a significant development in the competitive landscape of the sixth-generation artificial intelligence (AI) chip market.
According to Yonhap News Agency, the 2025 Semiconductor Exhibition (SEDEX) commenced its three-day event in southern Seoul, featuring the advanced HBM4 chips prominently displayed by both companies. This display signifies their intent to lead in the swiftly expanding sector of high-performance memory chips, crucial for Nvidia Corp.'s graphics processing units (GPUs) that support generative AI systems.
While the market is currently dominated by fifth-generation HBM3E chips, the industry anticipates the HBM4 to take precedence next year. This is largely due to Nvidia's plans to integrate it into its forthcoming AI accelerator, Rubin. SK hynix, the leading supplier of HBM3E in partnership with Nvidia and TSMC, has completed the development of HBM4 and is preparing for mass production. The company is reportedly negotiating with Nvidia for substantial supply agreements.
For Samsung Electronics, which has historically led the memory market but recently faced challenges in the HBM segment, the introduction of the HBM4 lineup represents an opportunity to reclaim its competitive position. During a shareholders' meeting in March, Jun Young-hyun, head of the semiconductor division at Samsung, committed to adhering to the development and mass production timelines for HBM4 products, aiming to avoid the setbacks experienced with the HBM3E market.
A recent report by research firm Counterpoint Research highlighted that SK hynix dominated the HBM market in the second quarter with a shipment share of 62 percent, followed by Micron Technology Inc. at 21 percent, and Samsung Electronics at 17 percent.