Seoul: SK hynix Inc. announced the commencement of its supply of mobile dynamic random-access memory (DRAM) products designed for high heat-efficiency, targeting the rising power consumption in devices equipped with artificial intelligence (AI) features.
According to Yonhap News Agency, SK hynix highlighted that the newly launched product incorporates an epoxy molding compound, a protective material for chips against water, heat, and impact. This advancement is anticipated to enhance smartphone battery performance and extend product lifespans by minimizing power consumption.
The development comes in response to the heat generated during rapid data transfers required for on-device AI applications, which has been known to degrade smartphone performance. Global smartphone manufacturers have expressed their approval of the new product, expecting it to mitigate the heat issues in high-performance flagship smartphones.
Lee Gyu-jei, head of SK hynix's package product development, emphasized the significance of the achievement, stating that it goes beyond mere performance enhancement by addressing common inconveniences experienced by users of high-performance smartphones.